Verfahren zum Aufrauen von Kupferoberflächen zur Bindung an Substraten

WP 600 47 278.7 – C23F 1/18. AT 16.11.2000; OT 12.07.2001; PT 13.06.2012. Anm.: OMG Electronic Chemicals, Inc., Mapel Plain, US. Erf.: Kucera, Al, Maple Grove, MN 55359, US, Gonzalez, Hector, Tracy, California 95376, US, Bernards, Roger, South Haven, Minnesota 55382, US, Schanhaar, Mike, St Michael, Minnesota 55376, US.